Basic Technology

Technology

In contrast to conventional LED lighting companies, who utilize a PCB, heatsink, housing and driver in conjunction with their LED’s, we invented and patented a “sandwich” system.  Our system, in which the LED is placed between two Aluminium Composite Panels (ACP’s), has enabled us to create LED lighting in panels that are only 6mm thick.

Aluminium Composite Panels (ACPs) have been used as a building material for decades. In short, an ACP consists of two thin layers of aluminium bonded by a non-metal core, with a typical thickness of only 6mm. They combine excellent mechanical properties with very low weight. And just like an LED, an ACP is a very sustainable material – it can be fully recycled, and can even be made of recycled material. Furthermore, Aluminium is a good conductor for both heat and electricity. In fact, most conventional LED heatsinks are made of aluminium.

LED iBond’s patented technology combines LEDs and ACPs. The ACP’s aluminium skins are used to transmit the electrical current to the LEDs, and likewise offer plenty of space to act as a very efficient heatsink.

These principles are the foundation for our lighting solutions for intelligent buildings, for UV disinfectant light and also for the development of vertical farming with coloured LEDs and a specialized ventilation system.

ACP - Aluminium Composite Panel

ACP with LED installed

Well thought through and simple

Since LED iBond products are not bound by conventional circuit boards, we can create a much smaller, lighter and more efficient package – our LED elements are designed to fit right into the ACP, keeping the overall thickness at 6mm. It also creates a much simpler, more reliable package.

LED iBond is better than most prepared for the ongoing branch shift between the light and IT sectors, where the 2 sectors looking ahead are increasingly seen as one sector.

LED iBond’s IPR and patents cover the combination of electronic products and sandwich structures, including the use of:

  • LEDs
  • Sensors
  • USB ports
  • Antennas
  • Cameras
  • Microphones
  • Speakers
  • Etc.

The benefits not only include better heat dissipation and a flexible, efficient supply of electrical power to the electronic components, but also cover data communication through the individual electrically conductive layers in the sandwich structure.

This means that light systems increasingly will become intelligent and computer-controlled, like electrical components increasingly will be integrated into lamps and lamp systems. LED iBond has developed and manufactured products that are prepared for further integration of IT hardware and software, including IoT functionality.

For example, Tracy has the same electrical capacity as a 14 mm copper cable diameter and can provide electrical power for not only LED lighting, but also for all other electronic devices built into Tracy either directly or via optional modules that can be connected to Tracy®.

LED iBond’s products are thus prepared to integrate all possible 3rd party products. Therefore, Tracy® is:

  • a super conducting wire in itself
  • a light panel and
  • a possible new connection to the outside world, for example in the form of a USB or terminal connector

While LED iBond’s platform was primarily designed to combine light, data and electricity, there is also a possibility to use the panels without light.  This solution is particularly aimed at helping IT, networking and device manufacturers lay the infrastructure framework for their IoT platform.  It is possible to run electricity and data, through a super-slim panel at a length in excess of 50 meters with one electrical input.

This solution is particularly geared towards:

  • IT Systems Integrators
  • Network Providers
  • Computer-Aided Facilities Management Software Companies
  • Architects and Engineers
  • Device and IoT Providers

LED iBond’s portfolio of patents comprises 8 patent families, which include the use of all of the mentioned electronic components as well as data communication through the electrically conductive layers.